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Skate 2 Pc Download Torrent Free1. Field of the Invention
The present invention relates to a method of manufacturing a light-emitting device comprising a semiconductor layer and an element electrode, which is formed on a conductive substrate, and a light-emitting element having a semiconductor layer and an electrode, which is formed on the conductive substrate, wherein the semiconductor layer is formed on the conductive substrate through the semiconductor layer forming step and the electrode forming step, the conductive substrate is separated into individual light-emitting elements by a method, which is carried out, immediately after the electrode forming step, between the separating step and the light-emitting element forming step, and the light-emitting elements are mounted and connected onto a wiring substrate or the like, which is different from the substrate on which the semiconductor layer is formed, and a light-emitting device manufactured by the method.
2. Description of the Related Art
A light-emitting device, such as a light-emitting diode, comprises a light-emitting element made of a semiconductor layer and an electrode, which is formed on a conductive substrate. The semiconductor layer is usually formed by means of a semiconductor layer forming method, such as a sputtering method or a CVD method, because the semiconductor layer can be deposited with high purity. Furthermore, the electrode is usually formed by means of an electric deposition method, such as a sputtering method or a CVD method, because the electrode can be deposited in high purity.
In the light-emitting device having a light-emitting element and electrodes, the electrodes should be individually formed on an individual element. In this case, the conductive substrate is separated into individual elements by means of a separating method, such as a scribing method or a dicing method. After the electrodes are formed, the electrodes are connected to a wiring substrate or the like, which is not provided with the conductive substrate.
The conventional light-emitting device of this type comprises the light-emitting element and the electrodes formed on the conductive substrate by the semiconductor layer forming method and the electrode forming method, wherein the electrodes are individually formed on the conductive substrate by means of the separating method such as the scribing method or the dicing method. At this time, mechanical stress, such as crack, is possibly generated in the semiconductor layer forming step and the electrode forming step, by the difference in the hardness between the
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